- HOME >
- 产品信息 >
- ATE >
- Memory Test Handler
ATE(Semiconductor Handler)
我们将成为拥有、引领最先进技术的企业。
各部门负责人联系方式 - Tel 041-559-8824/010-8368-7900 Fax 041-559-8738 Email atesales@mirae.com
M500HT
- 512para的高生产性
- 可通过±1.0℃的精密温度控制，进行准确的环境温度测试。
- 对存储器测试工艺最优化的测试机
M500HT
| 项目 | 产品配置 |
|---|---|
| 对接方式(Docking Type) | 垂直对接测试机 (Vertical Docking Test Handler) |
| Parallel ( Single Test head) | 512 |
| UPH | 40,960 (1Bin) |
| Jam Rate | 1/25,000 |
| 温度控制范围 (Temp Control Range) | -40℃ ~ +125℃ |
| 最小装备球间距(min. device ball pitch) | >0.35mm |
| 球边到包边间隙 ball edge to package edge clearance |
>0.3mm |
| 最小& 最大封装尺寸 Min & Max Package size |
6x6 ~ 12x12mm (正方形) |
| Up to 12x20mm (长方形) | |
| 最小/ 最大封装厚度(含球) Min/Max Package Thickness ( include balls) |
0.8-1.8mm |
| 目标封装 (Target Package) | TSOP, TQFP, BGA, MCP, POP CSP(μBGA, fBGA, QFN), etc. |
MH7
- NAND FLASH 生产性提升所需的768para测试机
- 利用P&P Head摄像机的自动修正位置
- 缩短室内温度稳定化所需时间，提升开工率。
MH7
| 项目 | 产品配置 |
|---|---|
| 对接方式(Docking Type) | 垂直对接测试机 Vertical Docking Test Handler |
| Parallel ( Single Test head) | 768 |
| UPH | 36,800 (1Bin) |
| Jam Rate | 1/30,000 |
| 温度控制范围 (Temp Control Range) | -40℃ ~ +125℃ |
| 最小装备球间距 (min. device ball pitch) | >0.35mm |
| 球边到包边间隙 ball edge to package edge clearance |
>0.3mm |
| 最小& 最大封装尺寸 Min & Max Package size |
6x6 ~ 12x12mm (正方形) |
| Up to 12x20mm (长方形) | |
| 最小/ 最大封装厚度(含球) Min/Max Package Thickness ( include balls) |
0.8-1.8mm |
| 目标封装 (Target Package) | TSOP, TQFP, BGA, MCP, POP, etc. |
MH5
- Factory Automation ready (OHT)
- Exchanger Auto Teaching Vision
- Unloading 3D Vision check
- Auto Contact Force
- Self-Diagnosis Program
MH5
| Items | Spec. |
|---|---|
| Type | OHT(OVERHEAD HOIST TRANSPORT) Type |
| Docking Type | Vertical Docking Test Handler |
| PARA | 512 |
| UPH | 40,960(1Bin) |
| Jam Rate | 1/50,000 |
| Temp Control Range | -40℃ ~+125℃ (-55℃ to 150℃ Option) |
| Min.Device Ball Pitch | >0.275 (0.3↓ Filim Type Use) |
| Ball Edge to Package Edge Clearance | >0.3mm |
| Min & Max Package Size | 6x6 ~12x12 (Square) / 12x20(Rectangle) |
| Min & Max Package Thickness(include balls) | 0.8~1.8mm |
| Target Package | TSOP. TQFP. BGA. MCP. TSOP. POP. CSP. Etc… |
| Option | Auto Teaching / 3D Vision / 2DID / Auto Contact Fine/ ATC / DiAGNOSIS |
各部门负责人联系方式 - Tel 041-559-8824/010-8368-7900 Fax 041-559-8738 Email atesales@mirae.com